
Our company has introduced large-scale flat plate cutting machines, ultrasonic cleaning machines, large-scale CNC engraving machines, water-flow cutting machines, polishing machines and other equipment, and can provide customers with glass cover plates, glass substrates, and glass with a thickness of ≧0.1mm and an overall size of ≧0.5mm. Products such as glass wafers are widely used in CMOS, CCD sensors, and micromechanical component packaging (MEMS), communications and data processing, optics, electronic products, LEDs and other fields. [
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